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Panarat Cherntanomwon
Meet
Panarat Cherntanomwon

Expertise:

Wireless and Mobile Communications | Indoor Positioning Systems | Internet of Things (IoT) and Smart Systems | Driving Advancements

Pronouns
she/her
Fun Fact
I studied in Japan and developed an obsession with cooking Japanese food, especially Japanese curry and Onigiri. Crazy about playing golf
Courses

n/a

I am an academic and researcher with a deep passion for engineering, technology, and global collaboration. My journey in this field began at King Mongkut’s Institute of Technology Ladkrabang (KMITL), Thailand, where I earned my B.Eng. in Telecommunication Engineering and M.Eng. in Electrical Engineering in 1998 and 2000, respectively. My academic path then led me to Japan, where I pursued a D.Eng. in International Development Engineering at the Tokyo Institute of Technology, specializing in Information and Communication Technology. Living and studying in Japan broadened my perspective on global technological trends, interdisciplinary collaboration, and the role of AI in shaping the future. It reinforced my belief that engineering is not just about developing new technologies but also about creating solutions that transcend borders, industries, and disciplines.

Currently, I serve as an Assistant Professor in the Department of Computer Engineering at KMITL and as the Associate Dean of Global Partnerships at CMKL University. In these roles, I am dedicated to bridging academia and industry, cultivating meaningful collaborations that bring research, innovation, and education together. My work at CMKL focuses on expanding strategic partnerships and creating opportunities for students and researchers to engage with cutting-edge technology on a global scale.

My research is centered around wireless and mobile communications, particularly in Indoor Positioning Systems (IPS). I apply AI-driven algorithms to enhance positioning accuracy and efficiency, exploring how AI, IoT, and smart systems can drive advancements in connectivity and intelligent technologies. I am always eager to explore new ways to harness technology for real-world impact and to inspire the next generation of engineers and innovators.

Education
  • B.Eng., Telecommunication Engineering, King Mongkut’s Institute of Technology Ladkrabang, Thailand
  • M.Eng., Electrical Engineering, King Mongkut’s Institute of Technology Ladkrabang, Thailand
  • D.Eng., in International Development Engineering, Tokyo Institute of Technology, Japan

Current Research

My research expertise focuses on wireless and mobile communications, particularly in Indoor Positioning Systems (IPS), where she applies AI-driven algorithms to enhance accuracy and efficiency. Her work also extends to the Internet of Things (IoT) and smart systems, driving advancements in AI-powered solutions for real-world applications in positioning, connectivity, and intelligent technologies.

Selected Publications
  • F. Y. M. Adiyatma, D. J. Suroso, and P. Cherntanomwong*, “TLB & WC-TLB-MM: The Improved Min-Max Algorithms for Multi Targets Indoor Localization,” IEEE Access, Electronic ISSN: 2169-3536, Vol.11, November 2023. (Q2-WoS and Q1 SJR) DOI: 10.1109/ACCESS.2023.3333901
  • D. J. Suroso, P. Cherntanomwong*, and P. Sooraksa, “Synthesis of a Small Fingerprint Database through a Deep Generative Model for Indoor Localization,” ELEKTRONIKA IR ELEKTROTECHNIKA, ISSN 1392-1215, Vol. 29, No. 1, 69-75, February 2023. (Q3-WoS-SJR) DOI: https://doi.org/10.5755/j02.eie.31905
  • D. J. Suroso, F. Y. M. Adiyatma, P. Cherntanomwong*, and P. Sooraksa, “Fingerprint Database Enhancement by Applying Interpolation and Regression Techniques for IoT-based Indoor Localization,” Emerging Science Journal, Vol. 4, 167-189, January 2022. (SJR-Q1) Doi: 10.28991/esj-2021-SP1-012
  • D. J. Suroso, P. Cherntanomwong*, and P. Sooraksa, “Indoor Device-free Localization Using Received Signal Strength Indicator and Illuminance Sensor for Random-forest-based Fingerprint Technique,” Sensors and Materials, Vol.33, No. 12, 4331-4345, December 2021. (SJR-Q3) Doi:https://doi.org/10.18494/SAM.2021.3632